Research Conclave on Advancing Semiconductor Design, Assembly, Testing, And Packaging in Southeast Asia

About the Event

The event aims to bring together researchers, academicians, industry experts, policymakers, and students to discuss recent advancements and emerging trends in semiconductor technologies. The conclave focuses on promoting innovation, strengthening academia-industry collaboration, encouraging interdisciplinary research, and developing skilled manpower to support the rapidly growing semiconductor ecosystem in Southeast Asia. The technical scope of the conclave includes a wide range of research areas such as VLSI design, analog and mixed-signal circuits, digital IC design, RF and microwave circuits, power semiconductor devices, embedded systems, low-power electronics, semiconductor materials and processes, nanoelectronics, reliability and failure analysis, MEMS and sensor technologies, electronic packaging, AI/ML applications in semiconductors, IC assembly and manufacturing, nanotechnology, and power electronic HEMTs based on GaN and SiC technologies. Researchers, academicians, and industry professionals are in

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