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Registration Open Sep 25, 2026 - Sep 27, 2026

Available Registration Options

Please select one of the registration types below to proceed with your registration.

Registration (Students/Research Scholars)

Available 0/100 registered
₹3,000.00 INR

Enroll/Register as Participant

Manual Registration Control

Registration (Faculty)

Available 0/50 registered
₹5,000.00 INR

Registration for the faculties

Manual Registration Control

Registration (Industry Professional)

Available 0/50 registered
₹8,000.00 INR

Registration for industry professional

Manual Registration Control

Registration (International Delegate)

Available 0/50 registered
₹20,000.00 INR

Registration for International Delegate

Manual Registration Control

Participation Only (Student/Research Scholar)

Available 0/50 registered
₹1,000.00 INR

Participation only registration

Manual Registration Control

Participation Only (Faculty)

Available 0/20 registered
₹2,000.00 INR

Registration fee for faculty participation only

Manual Registration Control

Participation Only (Industry Professional)

Available 0/20 registered
₹4,000.00 INR

Participation only registration fee for Industry Professional

Manual Registration Control

Participation Only (International Delegate)

Available 0/20 registered
₹10,000.00 INR

International Delegates participation only registration fee

Manual Registration Control

Event Details

EVENT

Research Conclave on Advancing Semiconductor Design, Assembly, Testing, And Packaging in Southeast Asia

DATE

Sep 25, 2026 - Sep 27, 2026

TIME

REGISTRATION DEADLINE

Sep 27, 2026 12:00 AM

About the Event

The Research Conclave, organized by the Department of Electronics and Communication Engineering, Assam Don Bosco University, in collaboration with the Center for Reliability Science and Technology (CReST), Chang Gung University, Taiwan, and the Department of Electronics and Communication Engineering, Gauhati University, aims to bring together researchers, industry experts, academicians, policymakers, and students to discuss recent advancements in semiconductor design, assembly, testing, and packaging in Southeast Asia. It seeks to promote innovation, strengthen academic-industry partnerships, encourage collaborative research, and develop skilled talent to support the rapidly growing semiconductor ecosystem in the region.
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